题名 | Interfacial study of polyimide/copper system using silane-modified polyvinylimidazoles as adhesion promoters |
作者 | J Jang, , T Earmme |
年|卷|期 | Volume 42, Issue 7, March 2001, |
页码 | Pages 2871–2876 |
链接 | http://www.sciencedirect.com/science/article/pii/S0032386100007011 |
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