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标题: Transient liquid phase sintering materials (TLPS) vs. conventional solders fo... [打印本页]

作者: andy11xu 时间: 2020-1-9 15:40
标题: Transient liquid phase sintering materials (TLPS) vs. conventional solders fo...

题名	Transient liquid phase sintering materials (TLPS) vs. conventional solders for high temperature MLCC interconnects.
链接	https://imapsource.org/doi/10.4071/isom-2016-THP42

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